TMTI & Standards

Only Corfin Industries is TMTI-qualified for tin whisker mitigation.


The three-year US Navy/CALCE/Raytheon TMTI study investigated the effectiveness and safety of Robotic Hot Solder Dip (RHSD) via extensive testing and destructive physical analysis of Corfin-processed parts. The TMTI study found that “in all cases, the existing finish was completely removed and no parts were damaged as a result of the process.”

Please click here to read the final TMTI report. *


Corfin also processes to the following industry specifications:

MIL-PRF-38534 and MIL-PRF-38535 for Solder Coverage
GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
IEC TS 62647-4 for Ball Grid Array Reballing
IPC/ANSI J-STD-001 for Trim and Form and Hot Solder Dip
IPC/ANSI J-STD-002 for Solderability Test
ANSI Standard EIA-481 for Tape and Reeling

We process to NASA, Military, Aerospace, and Manned Space Flight specifications.

Corfin is:
Nadcap AC7120 ELECTRONICS Accredited.
ISO 9001 and AS9100 registered.
Please click here for all of our quality certifications

For more information, please click here to download our Tin Whisker Brochure

* Mantech Project s1057