Corfin Industries prevents catastrophic failure in mission and life critical systems by eliminating the risks of tin whiskers and gold embrittlement. We provide component preparation services to the defense, aerospace, medical, telecommunications, transportation, industrial, and other high reliability industries. We pioneered our core technology, Robotic Hot Solder Dip, in the 1980′s and today serve major OEMs and their subcontractors around the world. Corfin Industries has earned an unmatched reputation for quality and dependability resulting in preferred status for numerous top tier global companies. Click below to learn more about what makes Corfin the most trusted name in component preparation solutions.

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eTECH, Inc. has key competencies in the area of BGA Reballing – serving markets in Military, Aerospace, Medical and other High-Tech sectors with a specialization in High Reliability Applications. The company has earned a reputation in the marketplace as offering superior customer service, quality, flexibility, and value.